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APS » Journals » Phys. Rev. ST Accel. Beams » Volume 4 » Issue 5
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Phys. Rev. ST Accel. Beams 4, 053502 (2001) [16 pages]

Diffusion bonding and brazing of high purity copper for linear collider accelerator structures

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Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1)

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2006 (1)

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Direct observations of rapid diffusion of Cu in Au thin films using in situ x-ray diffraction
J. W. Elmer, T. A. Palmer, E. D. Specht
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 24, 978 (2006)

 
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